The 2015 ISC High Performance Conference (ISC 2015) concluded its 30th meeting last week drawing 2,846 attendees, exceeding its own expectations. The organizers had initially expected around 2,600 to attend this year’s conference and exhibition, held in Frankfurt Germany from July 12 – 16.
Also at the event were 153 leading high performance computing vendors and research organizations from around the world, who exhibited from July 13 – 15.
Since it was first held as a seminar with 81 participants in 1986, the conference has become Europe’s largest and world’s second most significant HPC event. This year the conference drew participants from 56 countries, offering an extensive focus on HPC adoption in industry as well as its latest application in scientific fields.
“Having over 2,800 attendees at a new location was a gratifying experience,” said ISC Co-General Chair Martin Meuer.” Looking at the participant feedback, we can say that the attendees were very satisfied with the networking opportunity ISC 2015 had provided as well as the program content.”
“But we also realize that we need to work on other tangible aspects to improve our attendees’ experience at the venue, which is a challenging act for a moving conference like ours,” noted Meuer.
It was also exciting to see 380 members of the Asian HPC community make the trip to this year’s show, with China more than doubling its representation. The highest attendee numbers were from Central and Northern Europe, followed by Western and Southern Europe and North America.
Daily blogs highlighting some of the daily sessions and discussions is now available on YouTube. High-quality images of the conference and exhibition are also available for download at Flickr.
The 2015 ISC-HPCAC Student Cluster Competition
This year’s competition, in which 11 teams participated, was filled with surprises. The South African team that emerged as winners in the past two years was pushed into to second place by a team from Tsinghua University in China.
Here are the winners:
1st Place: Tsinghua University, China
2nd Place: Centre for High Performance Computing (CHPC), South Africa
3rd Place: University of Science and Technology of China, China
Highest LINPACK Performance: Jamia Millia Islamia University, India
Fan Favorite: Purdue University & Universidad EAFIT
The three-day competition was co-organized with the HPC Advisory Council. If you are interested in applying for the 2016 competition, please contact the organizers at email@example.com. Additional information is available here.
Next year, ISC High Performance will be held from June 19 – 23 in Frankfurt under the leadership of general co-chairs, Martin and Thomas Meuer and program chair, Prof. Dr. Satoshi Matsuoka of Tokyo Institute ofTechnology, Japan. For more information, please go to the 2016 website.
About ISC High Performance
Now in its 30th year, ISC High Performance is the world’s oldest and Europe’s most important conference and networking event for the HPC community. It offers a strong five-day technical program focusing on HPC technological development and its application in scientific fields, as well as its adoption in commercial environments.
Over 400 hand-picked expert speakers and 160 exhibitors, consisting of leading research centers and vendors, will greet attendees at ISC High Performance. A number of events complement the technical program including Tutorials, the TOP500 Announcement, Research Paper Sessions, Birds-of-a-Feather (BoF) Sessions, the Poster Sessions, Exhibitor Forums, and Workshops.
ISC High Performance is open to engineers, IT specialists, system developers, vendors, scientists, researchers, students, journalists, and other members of the HPC global community. The exhibition attracts decision-makers from automotive, finance, defense, aeronautical, gas & oil, banking, pharmaceutical and other industries, as well those providing hardware, software and services for the HPC community. Attendees will learn firsthand about new products and applications, in addition to the latest technological advances in the HPC industry.